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Bond Testing

BondCheck

The new BondCheck is a multi-mode bond testing flaw detector providing high speed bond inspection in pitch-catch or resonance modes, or mechanical impedance analysis (MIA), with excellent defect sensitivity.

Inspection applications include those where carbon and metal honeycombs need to be inspected for delaminations, disbonds and core damage as well as small defect detection and dry coupling. The BondCheck is ideal for a wide spectrum of advanced material NDT of required in the aerospace, automotive, wind energy and advanced manufacturing sectors.

Advantages of the BondCheck include:

  • Election of probe type available for different inspections
  • Flip function, for left or right handed users
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Overview

Housed in a lightweight instrument (1.2kg), with a common user interface between the three modes, the BondCheck delivers a simple and intuitive operator-led set up. The large daylight-readable display gives the BondCheck operator excellent data presentation and signal resolution. Users are able to configure colour schemes and use a secondary pane to create a split display with a choice of X-Y spot, frequency sweep, RF Waveform of spectrum displays; making the BondCheck an excellent great all round asset for inspection in the laboratory or out in the field.

The BondCheck Pitch-Catch Probe delivers high levels of performance and durability. Ergonomic design delivers robust and comfortable use. The position of the probe feet can be configured by the operator to suit the inspection task and the hard wearing probe tips are interchangeable; with rounded and flat tip profiles also available. The probe is broadband and is suitable for a wide range of applications.

BondCheck Resonance probes are available in a selection of frequencies (80, 100, 160, 200, 250 and 350kHz), and can also be supplied as a multi-probe kit. Both probe types have an Alarm LED and digital ID for ease of use, settings can be stored and “air calibration” is possible to establish the most sensitive inspection frequencies for your inspection.

The MIA technique is particularly useful for small defect detection, using a dry coupled probe with a small contact area. The technique offers excellent near surface defect sensitivity and is particularly suitable for top surface skin to core dis-bond detection for composite as well as metallic honeycomb structures.


Download our brochure:
BondCheck (1MB)


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